3C-SiC based sensors for harsh environments
presented by Gerard Colston
Sensing is a vital part of increasing efficiency and ensuring safety across many sectors including automotive, industrial, aerospace, environmental and biomedical sensing. Silicon (Si) is one of the predominant materials used in microelectromechanical (MEMS) and sensing devices due to its broad functionality and economics of scale. However, Si based devices are limited to operating temperature of up to ~200 °C and can easily be damaged by the effects of radiation or chemical attack. A solution to these issues is to heavily package the Si devices to protect the active parts, however, this makes final products bulky and expensive. Alternative materials can include ceramics which can operate at significantly higher temperatures but are affected by chemical poisoning and suffer in thermal or mechanical shocks.
Silicon carbide (SiC) is a wide bandgap semiconductor with properties similar to diamond and is resistant to radiation and all chemical etchants in ambient environment. SiC based devices can also operate up to temperature of 600 °C and beyond. With their novel cubic silicon carbide growth process, Advanced Epi is developing a range of SiC based sensors suitable for low-cost mass production using current Si based fabrication processes. These sensors will be suitable for a variety of applications such as temperature, pressure, air flow or UV sensing in harsh and demanding applications.
IoT International Conference
Silicon carbide heteroepitaxy for mass production of semiconductor devices
presented by Gerard Colston
For years now, the growth of cubic silicon carbide (3C-SiC) on silicon has required very high temperatures, making the process expensive and resulting in distorted epi wafers. Advanced Epi has developed a low temperature growth process of 3C-SiC on Si which uses standard silicon based, cold-wall, reduced pressure chemical vapour deposition. The process offers high growth rates of up to 10 µm/h and the films can be doped to specification during epitaxy. The high crystalline quality 3C-SiC is suitable for a range of applications such as a low lattice mismatched virtual substrate for GaN, thermal management, power electronics, sensors, MEMS, photonics and biomedical devices.
Compound Semiconductor International Conference
Advanced Epi exhibited at this years IoT International Conference held in Brussels on the 7th-8th March and presented the following talk:
Advanced Epi exhibited at this years CS International Conference held in Brussels on the 7th-8th March and presented the following talk:
Advanced Epi will be exhibiting at SEMICON Europa in Munich between the 14th - 17th November 2017.
We will be displaying our 100 and 150 mm 3C-SiC/Si epi wafers for GaN and sensor applications. We will also be exhibiting our double side growth epi wafers along with our new 3C-SiC square membranes for optical windows, TEM grid and pressure sensing applications.
Advanced Epi is proud to have recently become a member of the NMI a not-for-profit organisation promoting the operation and growth of the microelectronics industry in the UK and Ireland.